• CAN MAKE THE RESISTANCE IN THE WELDING PROCESS AUXILIARY ACCURATE RETURN, PROFESSIONAL SOLUTION QFN / BGA HOLLOW BUBBLE, DENSE FOOT IC RESIDUE AND SO
• IN THE WELDING, CAN MAKE THE PARENT METAL SURFACE OXIDE REDUCTION, EFFECTIVELY ELIMINATE THE OXIDE FILM
• HIGH TEMPERATURE WELDING, EFFECTIVELY PREVENT OXIDATION REACTION.
• TO A GREATER EXTENT REDUCE THE MATERIAL SURFACE TENSION, IMPROVE WETTING
PERRORMANCE
• AT THE SAME TIME CAN BE WIDELY USED IN WATCHES AND CLOCKS. PRECISION COMPONENTS, MEDICAL EQUIPMENT, MOBILE COMMUNICATIONS, DIGITAL PRODUCTS, ALL KINDS OF PCB BOARD AND BGA WELDING
• CAN MAKE THE RESISTANCE IN THE WELDING PROCESS AUXILIARY ACCURATE RETURN, PROFESSIONAL SOLUTION QFN / BGA HOLLOW BUBBLE, DENSE FOOT IC RESIDUE AND SO
• IN THE WELDING, CAN MAKE THE PARENT METAL SURFACE OXIDE REDUCTION, EFFECTIVELY ELIMINATE THE OXIDE FILM
• HIGH TEMPERATURE WELDING, EFFECTIVELY PREVENT OXIDATION REACTION.
• TO A GREATER EXTENT REDUCE THE MATERIAL SURFACE TENSION, IMPROVE WETTING
PERFORMANCE
• AT THE SAME TIME CAN BE WIDELY USED IN WATCHES AND CLOCKS, PRECISION COMPONENTS, MEDICAL EQUIPMENT, MOBILE COMMUNICATIONS, DIGITAL PRODUCTS, ALL KINDS OF PCB BOARD AND BGA WELDING
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