2
Cart Total
3,320.00
Checkout
2
Your cart
Your cart is empty.
Please go to Shop Now
Product Price Quantity Subtotal
1,660.00
3,320.00

IPHONE CPU STENCIL 8PIECES IP6-13 RL-044 IP RELIFE IP SERIES CPU INTEGRATED STEEL STENCIL SET

Add to wishlistAdded to wishlistRemoved from wishlist 1
- 41% IPHONE CPU STENCIL 8PIECES IP6-13 RL-044 IP RELIFE IP SERIES CPU INTEGRATED STEEL STENCIL SET
Add your review

Original price was: ₹2,800.00.Current price is: ₹1,660.00.

Only 2 left in stock

RELIFE IP SERIES CPU INTEGRATED STEEL STENCIL

SET 8 PIECES

IP6-13

SERIES

RL-044 IP

IPHONE CPU STENCIL 8PIECES IP6-13 RL-044 IP  RELIFE IP SERIES CPU INTEGRATED STEEL STENCIL SET
IPHONE CPU STENCIL 8PIECES IP6-13 RL-044 IP RELIFE IP SERIES CPU INTEGRATED STEEL STENCIL SET

Original price was: ₹2,800.00.Current price is: ₹1,660.00.

Description

IPHONE CPU STENCIL 8PIECES IP6-13 RL-044 IP  RELIFE IP SERIES CPU INTEGRATED STEEL STENCIL SET

 IPHONE CPU STENCIL 8PIECES IP6-13 RL-044 IP RELIFE IP SERIES CPU INTEGRATED STEEL STENCIL SET

BUY NOW

RELIFE IP SERIES CPU INTEGRATED STEEL STENCIL SET/8 PIECES/IP6-13 SERIES RL-044 IP 1.It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips. 2.Ultra-thin design, better fit of tin planting, continuous bending and full toughness. 3.High-quality special steel is selected, which has good high temperature resistance and metal fatigue resistance, so that each tin point is heated evenly. 4.Special chip half-cut + cut-through to meet different requirements. 5.Suitable for IP6G/6P/6S/6SP/7G/7P/8G/8P/X/XS/XS Max/XR/11/11 Pro/11 Pro Max/12/12 Mini/12 Pro/12 Pro Max/13/ 13 Mini/13 Pro/13 Pro Max.

RELIFE IP SERIES CPU INTEGRATED STEEL STENCIL SET/8 PIECES/IP6-13 SERIES RL-044 IP
1.It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips.
2.Ultra-thin design, better fit of tin planting, continuous bending and full toughness.
3.High-quality special steel is selected, which has good high temperature resistance and metal fatigue resistance, so that each tin point is heated evenly.
4.Special chip half-cut + cut-through to meet different requirements.
5.Suitable for IP6G/6P/6S/6SP/7G/7P/8G/8P/X/XS/XS Max/XR/11/11 Pro/11 Pro Max/12/12 Mini/12 Pro/12 Pro Max/13/ 13 Mini/13 Pro/13 Pro Max.

 

RELIFE IP SERIES CPU INTEGRATED STEEL STENCIL SET/8 PIECES/IP6-13 SERIES RL-044 IP

1.It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips.

2.Ultra-thin design, better fit of tin planting, continuous bending and full toughness.

3.High-quality special steel is selected, which has good high temperature resistance and metal fatigue resistance, so that each tin point is heated evenly.

4.Special chip half-cut + cut-through to meet different requirements.

5.Suitable for IP6G/6P/6S/6SP/7G/7P/8G/8P/X/XS/XS Max/XR/11/11 Pro/11 Pro Max/12/12 Mini/12 Pro/12 Pro Max/13/ 13 Mini/13 Pro/13 Pro Max

PRECISION GA STENCILS

Pioneering half etching process

“Cooling hole patented design

– Ultra-precise round square hole positioni

 

Videos

Videos: IPHONE CPU STENCIL 8PIECES IP6-13 RL-044 IP RELIFE IP SERIES CPU INTEGRATED STEEL STENCIL SET

mobilechip
Logo
Register New Account
Shopping cart