MECHANIC 183 SOLDER PASTE XG50 Sn63pb37

MECHANIC 183 SOLDER PASTE XG50 Sn63pb3

MECHANIC SPECIAL SOLDER PASTE XG-50 [35G] 183℃

MECHANIC XG-50 15G/35G LIQUID SOLDER PASTE SN63/PB37 LEADED SMD BGA SMT STENCIL

MECHANIC XG-50 35GM SMD SOLDER PASTE-3 MICRONS

THIS IS SOLDER PASTE FOR SOLDERING SMALL SMD COMPONENTS IN A REFLOW OVEN OR WITH A HOT AIR SOLDERING STATION. COMES IN A SMALL CONTAINER FOR PROTOTYPING OR REPAIRING JOB. THIS PACK IS THE RIGHT AMOUNT OF SOLDER PASTE FOR MOST HOBBY PROJECTS. THIS PASTE IS THE REPLACEMENT FOR SOLDER WIRE USED IN THROUGH-HOLE SOLDERING, SOME TIMES SOLDER FLUX IS REFERRED TO AS SOLDER PASTE. THIS SOLDER PASTE COMES IN A SPECIAL CONTAINER, WHEN IT IS SEALED, IT CAN SURVIVE FOR 6 MONTHS. IF YOU OPEN THE CONTAINER AND WANT TO STORE THE REST OF THE PASTE FOR FUTURE USE MAKE SURE IT IS TIGHT AND PLACE IT IN A PLASTIC ZIPPER POUCH AND PLACE IT IN THE REFRIGERATOR.

FEATURES/SPECS:

BRAND: MECHANIC
MODEL: XG-50
ALLOY: SN63/PB37
MICRONS: 3#
FLUX: IPX3
MELTING POINT: 183℃
WEIGHT: 35GM
APPLICATION:

GREAT SOLDERING REWORK TOOLS FOR SMART PHONE
PCB
BGA
MOTHERBOARD REPAIRING
PACKAGE INCLUDES:

1 X MECHANIC XG-50 35GM SMD SOLDER PASTE