IC Glue remover liquid S60

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IC Glue remover liquid S60

S-60 MECHANIC ADESIVE SOLUTION

BGA-IC

Special removal

solution for the

high-end electronic

BGA-IC拆胶液

Ehanced version BGA-IC adhesive solution S-60 also can help you to remove all kind of mobile phone frame sealing glue easily.

This product can be use to soften and remove the underfiller of mobile phone FC BGA chip and CPU chip.It’s made of the chemicals from DuPont. The formula of it is latest,environmental friendly and safest.It has good premeability.it can quickly soften and loosens solidified resin adhesive such as phenolics,epoxy.acrylate, polyurethane.organosilicon.It does not do harm to circuit board and component.

Usage:

Cover the BGA chip with the absorbent cotton which is dipped full of the adhesive solution. and then put the BGA chip into a samll plastic bag and seal the plastic bag up,after 20mins, repeat the process,remove the BGA chip with needle-like tool after the adhesive is softened. (Keep it on the cool place and aviod direct sunlight.)

Attention:

Aviod product touches skin and eyes,if they contact accidentally,please wash the skin or eyes with amount of water immediately.Please seal the cap of the bottle after use it,for fear that effect would be undermined because of the volatilization.Please open carefully for there is gas inside.

“This BGA glue S-60 can be used to remove black glue, white glue, etc. for mobile phones. It is suitable for softening and decomposing glue system of BGA resin sealant. It is dismantled and dismantled in DuPont IC company in the United States. The latest IC environmental protection and safety formula. Can  Soft, solid phenolic, silicone, mobile phone, fast-absorbing, silicone and other resins are harmful to circuit boards and glue-free.

  Instructions:

  When applying, use a small piece of potion to soak and disassemble, then cover it on the sealant, and then install a small film on the BGA chip, place the newly-made sealant horizontally in the shed, and then use the new sealant to soften the level.  Remove carefully with a needle tool.  (Keep away from light)

  Notice:

  The inside of the liquid medicine bottle is transparent and the skin is transparent and transparent if the liquid medicine is opened, and clean water can be used in case of accidental contact.

  Scope of application:

  Suitable for bottom filling of mobile phone FC BGA type CPU chip

  Gum-filled softened cellulose

  This product can be used to soften and remove the underfill of mobile phone FC BGA chips and CPU chips.6