Middle Layer Reballing Stencil For iPhone 14 Pro Max Plus 14Pro 14ProMax 14Plus
X to 14PM
Original price was: ₹4,000.00.₹3,600.00Current price is: ₹3,600.00.
Description
Middle Layer Reballing Stencil For iPhone 14 Pro Max Plus 14Pro 14ProMax 14Plus
Stencil iPhone 14 Pro Max Plus 14Pro 14ProMax 14Plus
Middle Layer Reballing Stencil IPHONE 14PRO
Middle Layer Reballing Stencil IPHONE 14PRO MAXX
Middle Layer Reballing Stencil IPHONE 14PLUS
Middle Layer Reballing Stencil IPHONE
IPHONE Middle Layer Reballing Stencil
Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone
BGA Reballing Stencil Kit for iPhone X XS XS MAX 11 Pro 12 Motherboard Middle Frame Planting Tin Reballing Platform
14 IN 1 BGA Reballing Stencil kit For iPhone X-13mini/13 Pro Max 14/14PRO/14PLUS/14PROMAXX/Motherboard Middle Layer Planting Tin Plate
14 IN 1 BGA Reballing Stencil kit For iPhone X-13mini/13 Pro Max 14/14PRO/14PLUS/14PROMAXX/Motherboard Middle Layer Planting Tin Plate
Middle Layer Reballing Stencil For iPhone 14 Pro Max Plus 14Pro 14ProMax 14Plus
RELIFE 14-IN-1 MID-TIER MOTHERBOARD REPAIR FIXTURE SET RL-601T
1.Suitable for IPX-14PM mid-tier motherboard repair.
2.Built-in three high-temperature strong magnets, strong magnetic adsorption, precise positioning, no offset, high temperature magnetism.
3.High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls.
4.High quality environmentally friendly stone, high strength, anti-dirt, easy to clean.
5.Universal base, unlimited compatibility, continuous model update, unlimited stacking without changing the base, One-time purchase, long-lasting use.
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